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This Defense Intelligence Reference Document, dated 23 March 2010 and produced by the Defense Intelligence Agency under its Advanced Aerospace Weapon System Applications (AAWSA) program, is a technical report on metallic spintronics. It explains giant magnetoresistance, spin-transfer torque and antiferromagnetic spintronics, along with their uses in sensors, hard drive read heads and magnetic memory. It concludes that spintronic devices could enable low-power, radiation-resistant electronics suited to aerospace and long space missions.
UNCLASSIFIED ),'FQA QFFIGI 1ak W&E 8PILM 2. Giant Magnetoresistance 2.1 GMR BASICS This section discusses the phenomenon of giant magnetoresistance (GMR). Excellent reviews of GMR are available elsewhere (Reference 12-22). The focus on physical concepts important for the sections to follow are discussed. GMR in magnetic multilayers refers to a dramatic reduction in the resistance of the multilayers when subjected to an external magnetic field. GMR's size is usually defined as the resistance change in magnetic field relative to its peak value. The effect can be distinguished from the ordinary magnetoresistance (MR) coming from the direct action of the magnetic field on the electron trajectories via the Lorentz force (Reference 23), and from the anisotropic MR, which comes from dependence of the resistivity on the relative orientation of magnetic moment to the current (Reference 24). To prepare the magnetic multilayers, where several atomic layers of one (ferromagnetic) material alternate by layers of another (nonmagnetic) material (see Figure l)r a wide variety of deposition methods have been used, such as electrochemical deposition techniques (Reference 25, 26) and various vacuum deposition techniques (Reference 27, 28). The latter shares mainly between two methods using either sputter deposition or molecular beam epitaxy (MBE) systems. Sputter deposition involves knocking off the atoms of the material of interest from a target by particle bombardment, followed by the deposition of high- energetic atoms ( ~2-30 electronvolts [ eV]) onto the substrate. A principal advantage of sputter deposition is the ease with which many different materials can be deposited at relatively high deposition rates. In contrast, deposition rates in MBE systems are usually much lower than for sputtering systems, but much lower energies (~0.1 eV) of the evaporated material Current In the Plane ,, Current Perpendicular ,, to the Plane Figure 1, In a Magnetic Multilayer, Several Atomic Layers of Magnetic Material (shown in grey) Alternate With Layers of Nonmagnetic Material (shown in white). GMR occurs in one of two dlfferent geometries: (1) when the current flows in the plane (CIP geometry) of the layers or (2) when the current flows perpendicular (CPP geometry) to the layers. make this technique favorable for growth of highly oriented single-crystalline films. The original observation of GMR (Reference 1) was made on MBE grown iron-chromium (Fe/Cr) multilayers with nearly perfect crystallinity. Subsequently, by using sputtered samples that are grown much more rapidly than MBE samples, it was possible not only to reproduce these results but also to observe oscillations in the magnetoresistance as the thickness of the nonmagnetic spacer layers was varied (Reference 29). Subsequent 1 UNCLASSIFIED;; rert SliFl@l;lde l!t&i &PlkY
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Report, from the dia collection. The PDF is mirrored here; the original link is above. 27 pages are in the text index: search them above, or from the library's search.